By 2030, a single AI accelerator package is projected to dissipate 6–15 kW. That works out to 300–750 W/cm² on average, with local hotspots above 1,000 W/cm². Against that demand, the conventional options run out early: Embedded microfluidic micropin-fin (MPF) cooling has been demonstrated at 1,700 W/cm² at device scale. That makes it the only …
Continue reading “Thermal Management for the 15kW Compute Era”
Building a silicon photonic startup means stepping into one of the most brutal talent wars in tech. You are competing for an incredibly scarce labor pool: engineers who simultaneously understand photonic architecture, ASIC/FPGA design, mixed-signal, RF design and advanced packaging. For a silicon photonic startup with unproven technology and limited deep pockets, assembling such a …
Continue reading “Breaking the Innovation Barrier: The Lean Core + AI Agent Model “
How fast and how many job functions can AI actually access, accelerate, or replace? To answer that, I have scored every role across five dimensions drawing on my experience across four very different industry sectors and what I have observed during my career stints. I have then mapped the results onto four axes to visualize …
Continue reading “AI & Agentic Coding: Deployment Impact Map”
Synopsis: As AI transitions from assisting with small tasks to autonomously managing full engineering work blocks, the innovator’s role is shifting from “doer” to “owner.” Drawing on a hands-on experiment building three Android apps in three months, this post explores why real-world deployment remains AI’s critical bottleneck, why human sagacity now commands a premium, and …
Continue reading “Breaking the Innovation Speed Barrier with AI: The Golden Age of Innovation”
KPIs & Business Plan
Key Takeaways: Increasing Design and Manufacturing Complexity associated with silicon chip development at < 5nm nodes and skyrocketing Development Costs will accelerate the use of Advanced Packaging across all market segments. The HPC/Server, Networking and High-End Smartphone market will be the “Lead Adopters” for Advanced Packaging Solutions. Co-Packaged Optics will see a major uptick to …
Continue reading “Advanced Packaging- Enabling Next Generation Silicon Chips”
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