Advanced Packaging- Enabling Next Generation Silicon Chips

Key Takeaways: Increasing Design and Manufacturing Complexity associated with silicon chip development at < 5nm nodes and skyrocketing Development Costs will accelerate the use of Advanced Packaging across all market segments. The HPC/Server, Networking and High-End Smartphone market will be the “Lead Adopters” for Advanced Packaging Solutions. Co-Packaged Optics will see a major uptick to …