Advanced Packaging- Enabling Next Generation Silicon Chips

Key Takeaways:

  1. Increasing Design and Manufacturing Complexity associated with silicon chip development at < 5nm nodes and skyrocketing Development Costs will accelerate the use of Advanced Packaging across all market segments.
  2. The HPC/Server, Networking and High-End Smartphone market will be the “Lead Adopters” for Advanced Packaging Solutions.
  3. Co-Packaged Optics will see a major uptick to address Compute and I/O bottlenecks in Distributed Deep Learning and Datacenter market.
  4. By 2027, the Consumer, Automotive, Defense, Aerospace, Industrial and Medical market segments will also increasingly adopt Advanced Packaging driven by new innovations, standardizations and price erosion as the technology matures.
  5. Discrete Components will see a price erosion as “Motherboard-On-A-Chip” becomes a reality.
  6. In-Memory Compute and Photonics will emerges as the next frontier of innovation; as will novel ways to build monolithic multi-layer silicon chips to address limits of lithography.

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