Key Takeaways:
- Increasing Design and Manufacturing Complexity associated with silicon chip development at < 5nm nodes and skyrocketing Development Costs will accelerate the use of Advanced Packaging across all market segments.
- The HPC/Server, Networking and High-End Smartphone market will be the “Lead Adopters” for Advanced Packaging Solutions.
- Co-Packaged Optics will see a major uptick to address Compute and I/O bottlenecks in Distributed Deep Learning and Datacenter market.
- By 2027, the Consumer, Automotive, Defense, Aerospace, Industrial and Medical market segments will also increasingly adopt Advanced Packaging driven by new innovations, standardizations and price erosion as the technology matures.
- Discrete Components will see a price erosion as “Motherboard-On-A-Chip” becomes a reality.
- In-Memory Compute and Photonics will emerges as the next frontier of innovation; as will novel ways to build monolithic multi-layer silicon chips to address limits of lithography.