{"id":480,"date":"2023-07-25T17:16:10","date_gmt":"2023-07-25T17:16:10","guid":{"rendered":"https:\/\/rohan-hubli.com\/?p=480"},"modified":"2023-07-26T09:41:05","modified_gmt":"2023-07-26T16:41:05","slug":"advanced-packaging-enabling-next-generation-silicon-chips","status":"publish","type":"post","link":"https:\/\/rohan-hubli.com\/index.php\/2023\/07\/25\/advanced-packaging-enabling-next-generation-silicon-chips\/","title":{"rendered":"Advanced Packaging- Enabling Next Generation Silicon Chips"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"480\" class=\"elementor elementor-480\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-5115d73a elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"5115d73a\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-613a7318\" data-id=\"613a7318\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-5b940a19 elementor-widget elementor-widget-text-editor\" data-id=\"5b940a19\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><\/p>\n<p><code><div class=\"_df_book df-lite\" id=\"df_477\"  _slug=\"advanced-packaging-enabling-next-generation-silicon-chips\" data-title=\"advanced-packaging-enabling-next-generation-silicon-chips\" wpoptions=\"true\" thumbtype=\"\" ><\/div><script class=\"df-shortcode-script\" nowprocket type=\"application\/javascript\">window.option_df_477 = {\"outline\":[],\"autoEnableOutline\":\"false\",\"autoEnableThumbnail\":\"false\",\"overwritePDFOutline\":\"false\",\"enableDownload\":\"false\",\"direction\":\"1\",\"pageSize\":\"0\",\"pageMode\":\"1\",\"singlePageMode\":\"0\",\"source\":\"https:\\\/\\\/rohan-hubli.com\\\/wp-content\\\/uploads\\\/2023\\\/07\\\/Advanced-Chip-Packaging-Enabling-NextGeneration-of-Silicon-Chips-v2.pdf\",\"wpOptions\":\"true\"}; if(window.DFLIP && window.DFLIP.parseBooks){window.DFLIP.parseBooks();}<\/script><\/code><\/p>\n<p><strong>Key Takeaways: <\/strong><\/p>\n<p><\/p>\n<ol>\n<li>Increasing Design and Manufacturing Complexity associated with silicon chip development at &lt; 5nm nodes and skyrocketing Development Costs will accelerate the use of Advanced Packaging across all market segments.<\/li>\n<li>The HPC\/Server, Networking and High-End Smartphone market will be the \u201cLead Adopters\u201d for Advanced Packaging Solutions.<\/li>\n<li>Co-Packaged Optics will see a major uptick to address Compute and I\/O bottlenecks in Distributed Deep Learning and Datacenter market.<\/li>\n<li>By 2027, the Consumer, Automotive, Defense, Aerospace, Industrial and Medical market segments will also increasingly adopt Advanced Packaging driven by new innovations, standardizations and price erosion as the technology matures.<\/li>\n<li>Discrete Components will see a price erosion as \u201cMotherboard-On-A-Chip\u201d becomes a reality.<\/li>\n<li>In-Memory Compute and Photonics will emerges as the next frontier of innovation; as will novel ways to build monolithic multi-layer silicon chips to address limits of lithography.<\/li>\n<\/ol>\n<p><\/p>\n<h2 class=\"wp-block-heading\">Categories<\/h2>\n<p><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Key Takeaways: Increasing Design and Manufacturing Complexity associated with silicon chip development at &lt; 5nm nodes and skyrocketing Development Costs will accelerate the use of Advanced Packaging across all market segments. The HPC\/Server, Networking and High-End Smartphone market will be the \u201cLead Adopters\u201d for Advanced Packaging Solutions. Co-Packaged Optics will see a major uptick to &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/rohan-hubli.com\/index.php\/2023\/07\/25\/advanced-packaging-enabling-next-generation-silicon-chips\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Advanced Packaging- Enabling Next Generation Silicon Chips&#8221;<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[24,23],"tags":[],"class_list":["post-480","post","type-post","status-publish","format-standard","hentry","category-semiconductors","category-technologytrends","entry"],"_links":{"self":[{"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/posts\/480","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/comments?post=480"}],"version-history":[{"count":10,"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/posts\/480\/revisions"}],"predecessor-version":[{"id":493,"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/posts\/480\/revisions\/493"}],"wp:attachment":[{"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/media?parent=480"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/categories?post=480"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/rohan-hubli.com\/index.php\/wp-json\/wp\/v2\/tags?post=480"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}